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11-MD118A
Version Issue Date File Name Total Page : A.004 : 2007-08-07 : SP-MD118A-A.004.doc : 20
8-BIT DAC VCM Driver with I2C Interface
9 7 1 SILICON TOUCH TECHNOLOGY INC.
9-4F-3, Prosperity Rd I, Science-Based Industrial Park Hsinchu, Taiwan, R.O.C. Tel886-3-5727171 Fax886-3-5727390
SILICON TOUCH TECHNOLOGY INC.
11-MD118A
8-Bit DAC VCM Driver with I2C Interface
General Specifications
The 11-MD118A is a VCM driver IC with I2C interface control that is capable of programmable output current sinking. It has a built-in internal voltage reference and operates in a wide supply voltage range from 2.4V to 5.5V. The DAC is controlled by a 2-wire I2C serial interface which operates in I2C fast mode (400 kHz). The 11-MD118A is designed for applications like image stabilization, auto-focus, and optical zoom in camera phones, digital still cameras, and other portable module devices.
Features and Benefits
Programmable output current sinking I2C serial interface 8-BIT DAC resolution 2.4V - 5.5V power supply Low voltage control for digital pin (PD, SDA, SCL) Power down operation Power on reset Constant current control Ultra small package: WLCSP1(0.84*1.84*0.5 mm), WLCSP2(1.0*2.0*0.45 mm) and DFN10 (3*3*0.8 mm)
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Pin Assignment
Pin Assignment of DFN10 (3*3*0.8mm)
Pin Descriptions
Pin NO. 1 2 3 4 5 6 7 8 9 10 1. Pin Name VDD PD NC VSS NC NC SDA SCL SEN SINK I2C Interface Data I2C Interface Data Analog Output : Programmable FSR Current Sinking Analog Output : Output Current Sink Ground Pin Description Power Supply Pin Digital Input: Power Down Mode(Low power down, High operation)
The I2C slave 7-bit address of 11-MD118A is 0001-1xx.
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Pin Assignment of WLCSP1 (0.84*1.84*0.5mm)
TOP View
A
B
1
2
3
4
Pin NO. A1 A2 A3 A4 B4 B3 B2 B1
Pin Name SEN PD SDA SCL VSS VSS SINK VDD
Description
Analog Output : Programmable FSR Current Sinking Digital Input: Power Down Mode(Logic `L': power down) I2C Interface Data I2C Interface Data Ground Pin Ground Pin Analog Output : Output Current Sink IC Power Pin
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Pin Assignment of WLCSP2 (1.0*2.0*0.45mm)
TOP View
Pin NO. WL1 WL2 WL3 WL4 WL5 WL6 WL7 WL8
Pin Name SEN PD SDA SCL VSS VSS VDD SINK
Description
Analog Output : Programmable FSR Current Sinking Digital Input: Power Down Mode(Logic `L': power down) I2C Interface Data I2C Interface Data Ground Pin Ground Pin Power Supply Pin Analog Output : Output Current Sink
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Absolute Maximum Ratings
Unless otherwise noted, TA= 25 Characteristic Supply Voltage Input Voltage Maximum Output Current Operating Temperature Range Storage Temperature Range Symbol VDD VIN IOUT TOPR TSTG Rating 5.5 VDD+0.4 130 -40 ~ 125 -65 ~ 150 Unit V V mA C C
Electrical Characteristic
Unless otherwise noted, TA= 25, VDD = 2.8 V and VCM loading = 28.5 Item Power Supply Supply Voltage Supply Current ( IDD ) VDD IPD IDD PD = L (Power down mode) PD = H (Operation mode) 2.4 2.8 3.5 5.5 0.5 4 V uA mA Sym. Condition Min. Limit Typ. Max. Unit
PD, SDA, SCL digital control pin Input Voltage "H" Input Voltage "L" Parameters Resolution INL DNL Zero Code Error Full Scale Voltage Least Significant Bit Output Current Settling Time 8 0.8 0.8 1 1 7 400 0.46 Bits LSB LSB mA mV mA VIH VIL 0.6*VDD -0.4 VDD+0.4 0.2*VDD V V
IOS
VFSR LSB
@ RSEN = 3.3 Voltage on the SEN Pin @ RSEN = 3.3 VDD = 2.8V, CL=1 F , 360 0.42
5 380 0.44
ts
@ RSEN = 3.3 , VCM( 28.5
120
200
s
, 460 H )
0.1 0.15 V
Saturation Voltage
VSAT
IOUT = 120 mA
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Block Diagram
(DFN10)
PD
2
VDD
1
Voltage Reference
SCL
8
I2C Interface
SDA
7
DAC
Output Driver
10
SINK
4
9
VSS
SEN
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Terminology
Resolution The DAC resolution is defined by the number of distinct analog levels corresponding to the number of bits it uses. N-bit resolution -> 2N distinct analog levels Differential Nonlinearity (DNL) error The variation in analog step sizes away from 1 LSB by any two adjacent codes. Usually, gain and offset errors have been removed. Integral Nonlinearity (INL) It is the deviation of actual transfer response from a straight line. Usually, INL error is referred to as the maximum INL error. Zero-Code Error Zero-Code error is the output error as the bits `0000-0000-00' are loaded into DAC register. Full Scale Voltage Full scale voltage is the maximum output voltage of the I2C DAC (SEN pin) as the bits `1111-1111-00' are loaded into 11-MD118A. Sink Current Sink Current is the input current driven by the power MOS embedded in the 11-MD118A.
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Data Format
11-MD118A Write Mode When in the write mode, data is written to the 11-MD118A and shifted step-by-step into the 16-bit input register. When all data has been loaded in and master signal receives a STOP condition, the loaded data in the input register is transferred to the DAC.
11-MD118A Read Mode When 11-MD118A is in the write mode, data is read back from IC to master in the same bit order.
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Table MSB LSB 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 Serial Data Bits 7 Input Register R15 R14 R13 R12 R11 R10 R09 R08 R07 R06 R05 R04 R03 R02 R01 R00 SPD X D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X Function SPD (Soft Power Down, 2nd standby mode): L is for IC active, and H just reset the DAC registers (D9~D0 -> 0) without shutdown analog cells for fast rising speed of output constant current. Regarding to all kinds of IC operation situations please refers to following table. PD L H SPD L H X denotes "Don't care/Unused". D(n), n = 2~9, are for 8-bit DAC data programming while D1 and D0 are forced to logic 0 assignment in order to guarantee 8-bit DAC resolution. The diagram shows the example of write mode. IC status Power down IC Active Soft power down
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Performance Characteristic
1. Typical DNL Plot
Typical DNL Plot @VDD=2.8V, 25degree 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1
DNL (LSB)
50
100 DIGITAL Code
150
200
250
2.
Typical INL Plot
Typical INL Plot @VDD=2.8V, 25degree 1 0.8 0.6 0.4 0.2 INL (LSB) 0 -0.2 -0.4 -0.6 -0.8 -1
50
100 DIGITAL Code
150
200
250
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3.
Output Sink Current Plot
Isink vs. DAC code @ different temperatures
110
100 90 80
70
Isink (mA)
60 50 40 -40 degree 25 degree 80 degree
30 20 10
50
100
150
200
250
DIGITAL Code
4.
Maximum Settling Time ( Which is current of SINK, ISINK, from 0 to maximum constant current)
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5.
Saturation voltage (ISINK@120mA)
11-MD118A
VDD = 2.8V
Vsat (mV)
Iout (mA)
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Application Circuit
Compensation Capacitor CL= 1 F
VCM VDD 10 F Rp Rp
1
10
IL
VDD SINK
11-MD118A
SDA
7
SCL
I2C Interface 8-BIT DAC
Output Driver
8
I2C MASTER DEVICE
I2C SLAVE DEVICE
PD
2
VSS
4
SEN
9
RSEN
PD = L (power down mode) PD = H (IC operation)
The Least Significant Bit (LSB) driving current of Voice Coil Actuator is determined by RSEN. For example, RSEN= 3.3. The Full Scale Voltage (VFSR) of SEN is 365mV and the Zero Code Error (IOS) is 5mA. The LSB driving current of Voice Coil Actuator is
. If input digital code is 0111-1111-00 (D9~D2 can be programmable, and D1~D0 are forced to logic 0). The driving current of Voice Coil Actuator (IL) is
I L = I OS + code * LSB = 5mA + 127*414uA 57.6mA
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Application Notes
The 11-MD118A is a constant current control IC for application in Auto-Focus. The supply voltage range VDD of 11-MD118A is from 2.4V to 5.5V. The input range of digital control pin PD, and digital I/O pins SCL and SDA, are defined such that logic "H" is from 0.6*VDD to VDD+0.4V and logic "L" is from -0.4V to 0.2*VDD. The PD pin is the enable pin of 11-MD118A. Logic high level (PD = H) is for IC operation. On the other hand, its logic low level (PD = L) puts the chip into power down mode for power saving. It is recommended to keep PD at low level (PD = L) before operation to reach the maximum efficiency of power saving, especially for applications in portable devices. In order to ensure the stability of output current, a compensation capacitance CL is suggested to be placed across the two terminals of VCM. The suggested value of CL is about 1uF and could be fine tuned for different VCM. The idea is to use frequency response compensation to ensure stability when VCM is operating. In order to guarantee 8-bit DAC resolution, DAC data, D1 and D0 are set to logic 0 only. There are 8-bit DAC data, D9~D2, are used for VCM constant current control via the two I2C serial data lines, SCL and SDA. If all 10 bits are used for DAC programming in an attempt to reach 10-bit DAC resolution, the DNL might get larger than 1 LSB due to glitch effect. In order to guarantee output current monotonically increases as the DAC code increases, it is suggested to utilize only 8-bit data programming to reach a better performance. The exposed paddle on the 11-MD118A should be soldered to ground to ensure the optimal thermal dissipation performance.
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IC packaging(WLCSP2) Power Dissipation The power consumption of IC varies widely with supply voltage, output current, and actuator loading. It is important to ensure the application does not exceed the allowable power dissipation of the IC package. The recommended Power De-rating Curve, power dissipation versus ambient temperature is depicted as follows. The work is done under JEDEC51-9.
Power De-rating Curve 1200 Power Dissipation (mW) 1000 800 600 400 200 0 0 10 20 30 40 50 60 70 80 90 Ambient Temp. TA(oC)
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Package Specification (DFN-10)
SYMBOL A A1 A3 b D D1 E E1 L e e1 MIN. 0.70 0.00 0.18 2.90 2.10 2.90 1.10 0.45
DIMENSION (mm) NOM. 0.75 0.02 0.203 REF 0.25 3.00 2.20 3.00 1.20 0.55 0.50 BASIC 2.00 BASIC
MAX. 0.80 0.05 0.30 3.10 2.30 3.10 1.30 0.65
MIN. 28 0 7 114 83 114 86 18
DIMENSION (mil) NOM. 30 0.8 8 REF 10 118 87 118 87 22 20 BASIC 79 BASIC
MAX. 32 2 12 122 91 122 91 26
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Package Specifications (WLCSP1)
Top View
E
(size: 0.84*1.84*0.5 mm)
A1 b
B1
A2
B2
A3
B3
A4
B4
L2 e2
SYMBOL A A1 S b D E e1 e2 L1 L2 MIN. 0.445 0.17 0.275 0.24 1.79 0.789
DIMENSION (mm) NOM. 0.50 0.2 0.300 0.26 1.84 0.839 0.4 0.4 0.320 0.220 MAX. 0.555 0.23 0.325 0.28 1.89 0.889
0.295 0.195
0.345 0.245
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Package Specifications (WLCSP2)
(size: 1.0*2.0*0.45 mm)
Top View
E
WL1 b
WL8
WL2
WL7
WL3
WL6
WL4
WL5
L2 e2
SYMBOL A A1 A2 b D E e1 e2 L1 L2 MIN. 0.40 0.08 0.32 0.26 1.95 0.95 0.48 0.48 0.22 0.22
DIMENSION (mm) NOM. 0.45 0.10 0.35 0.28 2.00 1.00 0.50 0.50 0.25 0.25 MAX. 0.50 0.12 0.38 0.30 2.05 1.05 0.52 0.52 0.28 0.28
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The products listed herein are designed for ordinary electronic applications, such as electrical appliances, audio-visual equipment, communications devices and so on. Hence, it is advisable that the devices should not be used in medical instruments, surgical implants, aerospace machinery, nuclear power control systems, disaster/crime-prevention equipment and the like. Misusing those products may directly or indirectly endanger human life, or cause injury and property loss. Silicon Touch Technology, Inc. will not take any responsibilities regarding the misusage of the products mentioned above. Anyone who purchases any products described herein with the above-mentioned intention or with such misused applications should accept full responsibility and indemnify. Silicon Touch Technology, Inc. and its distributors and all their officers and employees shall defend jointly and severally against any and all claims and litigation and all damages, cost and expenses associated with such intention and manipulation.
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